Full Line
i2C T18 LCD Display PCB Motherboard Layered Desoldering Station With Glue Removal Module, US Plug
i2C T18 LCD Display PCB Motherboard Layered Desoldering Station With Glue Removal Module, US Plug
-
Ordered
- - -
Order Ready
- - -
Delivered
i2C T18 LCD Display PCB Motherboard Layered Desoldering Station With Glue Removal Module, US Plug
local_shipping
Shipping Guarantee
Shipping Guarantee
FREE SHIPPING on all orders. Fully Insured.
Handling time 2 - 3 days. (Full Line OÜ has to process your order and put all your items through its strict quality-control tests.)
Transit time 7 - 14 days.
keyboard_returnrefreshcontent_copy
Return Guarantee
Return Guarantee
For whatever reason if you are unsatisfied with your order within 14 days you can return it to us in new condition for a refund.
package_2
DOA Guarantee
DOA Guarantee
If your item arrives damaged, please contact us within 14 days and provide clear and valid proof. Full Line OÜ will make compensation based on the damage situation.
rule
Missing/Wrong Items Guarantee
Missing/Wrong Items Guarantee
If you receive a parcel with missing/incorrect/secondary packing items, please contact us within 14 days of delivery and provide the relevant proof. Full Line will make compensation based on the damage situation.
2. Model: T18
3. Minimum temperature: 180 Celsius degree
4. Display: LED digital display
5. Maximum temperature: 245 Celsius degree
6. Body size: 13.4 x 11.6 x 1.7cm
7. Scope of use: motherboard separation and bonding
8. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof
9. LCD HD screen display, 2Gears of temp adjustment, Supports motherboard separation, chip CPU glue removal, and other functions
10. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance
11. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180Celsius degree in 60 seconds rapidly
12. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient
13. Put the chip on and switch to 245 Celsius degree, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
14. Only one host can support multiple modules, support double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products